RT Journal Article
T1 Elimination of Te precipitates from CdTe wafers
A1 Sochinskii, N. V.
A1 Dieguez, E.
A1 Pal, U.
A1 Piqueras De Noriega, Francisco Javier
A1 Fernández Sánchez, Paloma
A1 Agullorueda, F.
AB Undoped and doped CdTe wafers have been thermally annealed in Ga melt, or in Cd vapour or in a vacuum to eliminate Te precipitates from the volume of the wafers. The effect of annealing conditions on the transformation of Te precipitates has been studied by Raman scattering (RS) and cathodoluminescence (CL) techniques. The as and ct spectra of the as-grown and annealed wafers are discussed in connection with the doping and native structural defects and residual impurities. The kinetics of elimination of Te precipitates was found to be similar in the undoped and doped wafers. The rate of elimination is the highest for the annealing in Ga melt. Precipitate-free wafers have been obtained by annealing in Ga melt at 600 degrees C for 24 h. Simultaneously with the elimination of Te precipitates, Ga melt causes the in-diffusion of Ga atoms into the wafers. This implies that annealing in Ga melt could be a superior procedure for the elimination of Te precipitates from CdTe wafers in which Ga doping is not important or is desired.
PB Iop Publishing Ltd
SN 0268-1242
YR 1995
FD 1995-06
LK https://hdl.handle.net/20.500.14352/59259
UL https://hdl.handle.net/20.500.14352/59259
LA eng
NO © 1995 iOP Publishing Ltd.Two of us (NVS and UP) thank research fellowships  from the Spanish Ministeno de Educacion y Ciencia. This work has been supported by DGICYT (project PB93- 1256).
NO DGICYT
NO Spanish Ministeno de Educacion y Ciencia
DS Docta Complutense
RD 7 abr 2025