RT Conference Proceedings
T1 Rheology of conducting polymer composites for 3D printing electronic applications
A1 Ares Pernas, Ana
A1 Dopico, Sonia
A1 Lage, Silvia
A1 Arias Ferreiro, Goretti
A1 Lasagabaster Latorre, Aurora
A1 Abad, María José
AB Rheological analysis is a valuable tool for comprehending the microstructure of polymeric compounds. In this work different composites from 3D printing were studied using rheology in order to choose the best formulation without the need of spending a lot of material with other techniques. In this AQ2 sense in the first stage new thermoplastic composites with biopolymeric matrix, for electrical and sensor applications, were designed selecting by means of rhe ology the best mixture for solving PLA (4:1 DCM:acetone), the amount of filler AQ3 (up to 2 wt.% of MWCNTs) and the greener additive (1 wt.% of lignine). In the second stage rheological measurements allow to design new photopolymerizable composites, for piezoresistive and piezocapacitive sensors, choosing the best combination between the amount of conducting filler (5 wt.% PANI), crosslinker (15 wt.% HDODA) and initiator (7 wt.% TPO).
SN 978-3-031-67216-3 (Print)
SN 978-3-031-67217-0 (Online)
SN 2662-3161
YR 2024
FD 2024
LK https://hdl.handle.net/20.500.14352/117323
UL https://hdl.handle.net/20.500.14352/117323
LA eng
NO Ares-Pernas, A., Dopico, S., Lage, S., G.Arias-Ferreiro, Lasagabaster, A., Abad, M.J. (2024). Rheology of Conducting Polymer Composites for 3D Printing Electronic Applications. In: Raymundo, A., Alves, V.D., Sousa, I., Galindo-Rosales, F.J. (eds) Proceedings of the Iberian Meeting on Rheology (IBEREO 2024). IBEREO 2024. Springer Proceedings in Materials, vol 56. Springer, Cham. https://doi.org/10.1007/978-3-031-67217-0_26
NO Xunta de Galicia
NO Ministerio de Ciencia e Innovacion (España)
DS Docta Complutense
RD 30 dic 2025