TY  - CONF
AU  - Ares Pernas, Ana
AU  - Dopico, Sonia
AU  - Lage, Silvia
AU  - Arias Ferreiro, Goretti
AU  - Lasagabaster Latorre, Aurora
AU  - Abad, María José
PY  - 2024
DO  - 10.1007/978-3-031-67217-0_26
SN  - 978-3-031-67216-3 (Print)
SN  - 978-3-031-67217-0 (Online)
SN  - 2662-3161
UR  - https://hdl.handle.net/20.500.14352/117323
AB  - Rheological analysis is a valuable tool for comprehending the microstructure of polymeric compounds. In this work different composites from 3D printing were studied using rheology in order to choose the best formulation without the need of spending a...
LA  - eng
M2  - 117
KW  - Additive manufacturing
KW  - Digital light processing
KW  - 3D printing
KW  - Electronic applications
KW  - Rheology
TI  - Rheology of conducting polymer composites for 3D printing electronic applications
TY  - conference output
ER  -