RT Journal Article
T1 Validity of thin element approximation in diffractometry of opaque thick objects
A1 Sánchez Brea, Luis Miguel
A1 Soria García, Angela
A1 Andres Porras, Joaquín
A1 Del Hoyo Muñoz, Jesús
A1 Torcal Milla, Francisco José
A1 Hamdy Mohamed Elshorbagy, Mahmoud
A1 Pastor Villarrubia, Veronica
A1 Alda Serrano, Javier
AB The Thin Element Approximation (TEA) is widely used in diffraction analyses since it can be applied in efficient plane-to-plane propagation algorithms. While refinements have been developed for dielectric objects to obtain more accurate results, TEA is assumed precise for opaque objects. However, through numerical simulations presented in this work, based on Wave Propagation Method, we analyze the tendency of TEA to overestimate the dimensions of opaque objects in diffractometry. This effect was acknowledged in the case of cylinders, and we obtain similar results for the case of rectangular thick strips. On the other hand, TEA demonstrates a high level of accuracy when applied to objects with thickness concentrated at the center and thin edges, such as the isosceles triangular obstacle. Finally, we analyze objects whose shape is defined using the superellipse function, which is chosen for its versatility in generating objects of equivalent width and maximum thickness but with different shapes just changing a single parameter. Our results highlight the importance of considering the object geometry when employing this approximation in diffraction studies of opaque three-dimensional objects.
PB Elsevier
SN 0030-4026
YR 2024
FD 2024-05-30
LK https://hdl.handle.net/20.500.14352/135173
UL https://hdl.handle.net/20.500.14352/135173
LA eng
NO Sanchez-Brea, Luis Miguel, et al. «Validity of Thin Element Approximation in Diffractometry of Opaque Thick Objects». Optik, vol. 311, septiembre de 2024, p. 171900. DOI.org (Crossref), https://doi.org/10.1016/j.ijleo.2024.171900.
NO © 2024 The Author(s).
NO Ministerio de Ciencia e Innovación (España)
NO Agencia Estatal de Investigación
NO European Comission
DS Docta Complutense
RD 8 jun 2026