%0 Journal Article
%A Cuesta, David
%A Hidalgo, J. Ignacio
%A Risco Martín, José Luis
%A Ayala Rodrigo, José Luis
%T 3D thermal-aware floorplanner using a MOEA approximation
%D 2013
%U https://hdl.handle.net/20.500.14352/113287
%X Two of the major concerns in 3D stacked technology are heat removal and power density distribution. In our work, we propose a novel 3D thermal-aware floorplanner. Our contributions include:1. A novel multi-objective formulation to consider the thermal and performance constraints in the optimization approach.2. Two efficient Multi-Objective Evolutionary Algorithm (MOEA) for the representation of the floorplanning model and for the optimization of thermal parameters and wire length.3. A smooth integration of the MOEA model with an accurate thermal modelling of the architecture.The experimental work is conducted for two realistic many-core single-chip architectures: an homogeneous system resembling INTEL’s SCC, and an improved heterogeneous setup. The results show promising improvements of the mean and peak temperature, as well as the thermal gradient, with a reduced overhead in the wire length of the system.
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