RT Journal Article
T1 3D thermal-aware floorplanner using a MOEA approximation
A1 Cuesta, David
A1 Hidalgo, J. Ignacio
A1 Risco Martín, José Luis
A1 Ayala Rodrigo, José Luis
AB Two of the major concerns in 3D stacked technology are heat removal and power density distribution. In our work, we propose a novel 3D thermal-aware floorplanner. Our contributions include:1. A novel multi-objective formulation to consider the thermal and performance constraints in the optimization approach.2. Two efficient Multi-Objective Evolutionary Algorithm (MOEA) for the representation of the floorplanning model and for the optimization of thermal parameters and wire length.3. A smooth integration of the MOEA model with an accurate thermal modelling of the architecture.The experimental work is conducted for two realistic many-core single-chip architectures: an homogeneous system resembling INTEL’s SCC, and an improved heterogeneous setup. The results show promising improvements of the mean and peak temperature, as well as the thermal gradient, with a reduced overhead in the wire length of the system.
YR 2013
FD 2013
LK https://hdl.handle.net/20.500.14352/113287
UL https://hdl.handle.net/20.500.14352/113287
LA eng
DS Docta Complutense
RD 21 abr 2025