TY  - JOUR
AU  - Cuesta, David
AU  - Hidalgo, J. Ignacio
AU  - Risco Martín, José Luis
AU  - Ayala Rodrigo, José Luis
PY  - 2013
DO  - 10.1016/j.vlsi.2012.04.003
UR  - https://hdl.handle.net/20.500.14352/113287
T2  - Integration, the VLSI Journal
AB  - Two of the major concerns in 3D stacked technology are heat removal and power density distribution. In our work, we propose a novel 3D thermal-aware floorplanner. Our contributions include:1. A novel multi-objective formulation to consider the thermal...
LA  - eng
M2  - 10
TI  - 3D thermal-aware floorplanner using a MOEA approximation
TY  - journal article
VL  - 46
ER  -