TY  - JOUR
AU  - Cuesta, David
AU  - Risco Martín, José Luis
AU  - Ayala Rodrigo, José Luis
PY  - 2012
DO  - 10.1016/j.micpro.2012.02.012
UR  - https://hdl.handle.net/20.500.14352/119290
T2  - Microprocessors and Microsystems
AB  - One of the most important concerns in 3D technology is heat removal. In this paper we propose a 3D thermal-aware floorplanner. Our contributions include: (1) a novel multi-objective formulation to consider the thermal and performance constraints in...
LA  - eng
M2  - 344
PB  - Elsevier
TI  - 3D thermal-aware floorplanner using a MILP approximation
TY  - journal article
VL  - 36
ER  -