RT Journal Article
T1 Solderjet bumping technique used to manufacture a compact and robust green solid-state laser
A1 Ribes Pleguezuelo, Pol
A1 Burkhardt, Thomas
A1 Hornaff, M.
A1 Kousar, S.
A1 Burkhardt, D.
A1 Becker, Erik
A1 Gilaberte, Marta
A1 Guilhot, D.
A1 Montes, David
A1 Galán, Miguel
A1 Ferrando, Sergi
A1 Laudisio, Marco
A1 Belenguer Dávila, Tomás
A1 Ibarmia, S.
A1 Gallego, P.
A1 Rodríguez, J.A.
A1 Eberhardt, Ramona
A1 Tünnermann, Andreas
AB Solder-joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals due to a localized and minimized input of thermal energy. The Solderjet Bumping technique is used to assemble a miniaturized laser resonator in order to obtain higher robustness, wider thermal conductivity performance, higher vacuum and radiation compatibility, and better heat and long term stability compared with identical glued devices. The resulting assembled compact and robust green diode-pumped solid-state laser is part of the future Raman Laser Spectrometer designed for the Exomars European Space Agency (ESA) space mission 2018.
PB SPIE
SN 0277-786X
YR 2015
FD 2015-06-01
LK https://hdl.handle.net/20.500.14352/24686
UL https://hdl.handle.net/20.500.14352/24686
LA eng
NO From Conference Volume 9520; Integrated Photonics: Materials, Devices, and Applications III. Jean-Marc Fédéli; Barcelona, Spain; May 04, 2015.Copyright (2015) Society of Photo Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.
NO Ministerio de Economía y Competitividad (MINECO)
NO INTA (Instituto Nacional de Tecnología Aeroespacial – España)
DS Docta Complutense
RD 8 abr 2025