TY  - JOUR
AU  - Ribes Pleguezuelo, Pol
AU  - Burkhardt, Thomas
AU  - Hornaff, M.
AU  - Kousar, S.
AU  - Burkhardt, D.
AU  - Becker, Erik
AU  - Gilaberte, Marta
AU  - Guilhot, D.
AU  - Montes, David
AU  - Galán, Miguel
AU  - Ferrando, Sergi
AU  - Laudisio, Marco
AU  - Belenguer Dávila, Tomás
AU  - Ibarmia, S.
AU  - Gallego, P.
AU  - Rodríguez, J.A.
AU  - Eberhardt, Ramona
AU  - Tünnermann, Andreas
PY  - 2015
DO  - 10.1117/12.2178373
SN  - 0277-786X
UR  - https://hdl.handle.net/20.500.14352/24686
T2  - Proceedings of SPIE
AB  - Solder-joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and...
LA  - eng
M2  - 6p.
PB  - SPIE
KW  - metallic solder
KW  - laser soldering processes
KW  - optical components
KW  - Raman Laser Spectrometer
TI  - Solderjet bumping technique used to manufacture a compact and robust green solid-state laser
TY  - journal article
VL  - 9520
ER  -