RT Journal Article
T1 Three-dimensional measurement of microchips using structured light techniques
A1 Quiroga Mellado, Juan Antonio
A1 Vargas Balbuena, Javier
A1 Koninckx, Thomas
A1 Van Gool, Luc
AB The industry dealing with microchip inspection requires fast, flexible, repeatable, and stable 3-D measuring systems. The typical devices used for this purpose are coordinate measurement machines (CMMs). These systems have limitations such as high cost, low measurement speed, and small quantity of measured 3-D points. Now optical techniques are beginning to replace the typical touch probes because of their noncontact nature, their full-field measurement capability, their high measurement density, as well as their low cost and high measurement speed. However, typical properties of microchip devices, which include a strongly spatially varying reflectance, make impossible the direct use of the classical optical 3-D measurement techniques. We present a 3-D measurement technique capable of optically measuring these devices using a camera-projector system. The proposed method improves the dynamic range of the imaging system through the use of a set of gray-code (GC) and phase- shift (PS) measures with different CCD integration times. A set of extended-range GC and PS images are obtained and used to acquire a dense 3-D measure of the object. We measure the 3-D shape of an integrated circuit and obtained satisfactory results.
PB Spie-Soc Photo-Optical Instrumentation Engineers
SN 0091-3286
YR 2008
FD 2008-05
LK https://hdl.handle.net/20.500.14352/50784
UL https://hdl.handle.net/20.500.14352/50784
NO © 2008 Society of Photo-Optical Instrumentation Engineers.
DS Docta Complutense
RD 8 jun 2026