TY  - JOUR
AU  - Arnaldo, Ignacio
AU  - Higalgo, J. Ignacio
AU  - Risco Martín, José Luis
AU  - Ayala Rodrigo, José Luis
PY  - 2012
DO  - 10.1049/iet-cds.2011.0350
UR  - https://hdl.handle.net/20.500.14352/119961
T2  - IET Circuits, Devices & Systems
AB  - Three-dimensional (3D) integration has become one of the most promising techniques for the development of future multi-core processors, since it improves performance and reduces power consumption by decreasing global wire length. However, 3D...
LA  - eng
M2  - 322
PB  - The Institution of Engineering and Technology
TI  - Power profiling-guided floorplanner for 3D multi-processor systems-on-chip
TY  - journal article
VL  - 6
ER  -