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00925njm 22002777a 4500 dc Ares Pernas, Ana author Dopico, Sonia author Lage, Silvia author Arias Ferreiro, Goretti author Lasagabaster Latorre, Aurora author Abad, María José author 2024 Rheological analysis is a valuable tool for comprehending the microstructure of polymeric compounds. In this work different composites from 3D printing were studied using rheology in order to choose the best formulation without the need of spending a lot of material with other techniques. In this AQ2 sense in the first stage new thermoplastic composites with biopolymeric matrix, for electrical and sensor applications, were designed selecting by means of rhe ology the best mixture for solving PLA (4:1 DCM:acetone), the amount of filler AQ3 (up to 2 wt.% of MWCNTs) and the greener additive (1 wt.% of lignine). In the second stage rheological measurements allow to design new photopolymerizable composites, for piezoresistive and piezocapacitive sensors, choosing the best combination between the amount of conducting filler (5 wt.% PANI), crosslinker (15 wt.% HDODA) and initiator (7 wt.% TPO). Ares-Pernas, A., Dopico, S., Lage, S., G.Arias-Ferreiro, Lasagabaster, A., Abad, M.J. (2024). Rheology of Conducting Polymer Composites for 3D Printing Electronic Applications. In: Raymundo, A., Alves, V.D., Sousa, I., Galindo-Rosales, F.J. (eds) Proceedings of the Iberian Meeting on Rheology (IBEREO 2024). IBEREO 2024. Springer Proceedings in Materials, vol 56. Springer, Cham. https://doi.org/10.1007/978-3-031-67217-0_26 978-3-031-67216-3 (Print) 978-3-031-67217-0 (Online) 2662-3161 10.1007/978-3-031-67217-0_26 https://hdl.handle.net/20.500.14352/117323 2662-317X https://doi.org/10.1007/978-3-031-67217-0_26 Rheology of conducting polymer composites for 3D printing electronic applications