2026-06-08T11:06:02Zhttps://docta.ucm.es/rest/oai/request

oai:docta.ucm.es:20.500.14352/1173232025-03-18T12:01:22Zcom_20.500.14352_14col_20.500.14352_20

Rheology of conducting polymer composites for 3D printing electronic applications Ares Pernas, Ana Dopico, Sonia Lage, Silvia Arias Ferreiro, Goretti Lasagabaster Latorre, Aurora Abad, María José Rheological analysis is a valuable tool for comprehending the microstructure of polymeric compounds. In this work different composites from 3D printing were studied using rheology in order to choose the best formulation without the need of spending a lot of material with other techniques. In this AQ2 sense in the first stage new thermoplastic composites with biopolymeric matrix, for electrical and sensor applications, were designed selecting by means of rhe ology the best mixture for solving PLA (4:1 DCM:acetone), the amount of filler AQ3 (up to 2 wt.% of MWCNTs) and the greener additive (1 wt.% of lignine). In the second stage rheological measurements allow to design new photopolymerizable composites, for piezoresistive and piezocapacitive sensors, choosing the best combination between the amount of conducting filler (5 wt.% PANI), crosslinker (15 wt.% HDODA) and initiator (7 wt.% TPO). 2025-01-30T14:27:41Z 2025-01-30T14:27:41Z 2024 conference output Ares-Pernas, A., Dopico, S., Lage, S., G.Arias-Ferreiro, Lasagabaster, A., Abad, M.J. (2024). Rheology of Conducting Polymer Composites for 3D Printing Electronic Applications. In: Raymundo, A., Alves, V.D., Sousa, I., Galindo-Rosales, F.J. (eds) Proceedings of the Iberian Meeting on Rheology (IBEREO 2024). IBEREO 2024. Springer Proceedings in Materials, vol 56. Springer, Cham. https://doi.org/10.1007/978-3-031-67217-0_26 978-3-031-67216-3 (Print) 978-3-031-67217-0 (Online) 2662-3161 10.1007/978-3-031-67217-0_26 https://hdl.handle.net/20.500.14352/117323 2662-317X https://doi.org/10.1007/978-3-031-67217-0_26 eng info:eu-repo/grantAgreement/AEI/Plan Estatal de Investigación Científica y Técnica y de Innovación 2017-2020/PID2020-116976RB-I00/ES/REVALORIZACION DE LIGNINA EN COMPUESTOS POLIMERICOS CONDUCTORES PARA IMPRESION 3D / restricted access