2026-06-08T08:51:38Zhttps://docta.ucm.es/rest/oai/request

oai:docta.ucm.es:20.500.14352/507842023-08-27T07:33:55Zcom_20.500.14352_14col_20.500.14352_15

Quiroga Mellado, Juan Antonio Vargas Balbuena, Javier Koninckx, Thomas Van Gool, Luc 2023-06-20T10:37:02Z 2023-06-20T10:37:02Z 2008-05 0091-3286 10.1117/1.2919726 https://hdl.handle.net/20.500.14352/50784 http://dx.doi.org/10.1117/1.2919726 http://opticalengineering.spiedigitallibrary.org The industry dealing with microchip inspection requires fast, flexible, repeatable, and stable 3-D measuring systems. The typical devices used for this purpose are coordinate measurement machines (CMMs). These systems have limitations such as high cost, low measurement speed, and small quantity of measured 3-D points. Now optical techniques are beginning to replace the typical touch probes because of their noncontact nature, their full-field measurement capability, their high measurement density, as well as their low cost and high measurement speed. However, typical properties of microchip devices, which include a strongly spatially varying reflectance, make impossible the direct use of the classical optical 3-D measurement techniques. We present a 3-D measurement technique capable of optically measuring these devices using a camera-projector system. The proposed method improves the dynamic range of the imaging system through the use of a set of gray-code (GC) and phase- shift (PS) measures with different CCD integration times. A set of extended-range GC and PS images are obtained and used to acquire a dense 3-D measure of the object. We measure the 3-D shape of an integrated circuit and obtained satisfactory results. metadata only access Three-dimensional measurement of microchips using structured light techniques journal article