2026-06-07T19:16:03Zhttps://docta.ucm.es/rest/oai/request

oai:docta.ucm.es:20.500.14352/507842023-08-27T07:33:55Zcom_20.500.14352_14col_20.500.14352_15

Three-dimensional measurement of microchips using structured light techniques Quiroga Mellado, Juan Antonio Vargas Balbuena, Javier Koninckx, Thomas Van Gool, Luc The industry dealing with microchip inspection requires fast, flexible, repeatable, and stable 3-D measuring systems. The typical devices used for this purpose are coordinate measurement machines (CMMs). These systems have limitations such as high cost, low measurement speed, and small quantity of measured 3-D points. Now optical techniques are beginning to replace the typical touch probes because of their noncontact nature, their full-field measurement capability, their high measurement density, as well as their low cost and high measurement speed. However, typical properties of microchip devices, which include a strongly spatially varying reflectance, make impossible the direct use of the classical optical 3-D measurement techniques. We present a 3-D measurement technique capable of optically measuring these devices using a camera-projector system. The proposed method improves the dynamic range of the imaging system through the use of a set of gray-code (GC) and phase- shift (PS) measures with different CCD integration times. A set of extended-range GC and PS images are obtained and used to acquire a dense 3-D measure of the object. We measure the 3-D shape of an integrated circuit and obtained satisfactory results. 2023-06-20T10:37:02Z 2023-06-20T10:37:02Z 2023-06-20T10:37:02Z 2008-05 journal article https://hdl.handle.net/20.500.14352/50784 0091-3286 10.1117/1.2919726 metadata only access Spie-Soc Photo-Optical Instrumentation Engineers