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Influence of rapid thermal annealing processes on the properties of SiNx : H films deposited by the electron cyclotron resonance method

dc.contributor.authorMartil De La Plaza, Ignacio
dc.contributor.authorGonzález Díaz, Germán
dc.contributor.authorMartínez, F.L.
dc.contributor.authorSelle, B.
dc.contributor.authorSieber, I.
dc.date.accessioned2023-06-20T19:08:06Z
dc.date.available2023-06-20T19:08:06Z
dc.date.issued1998-05
dc.descriptionInternational Conference on Amorphous and Microcrystalline Semiconductors - Science and Technology (ICAMS 17) (17. 1997. Budapest, Hungría). © Elsevier Science BV.
dc.description.abstractWe have analyzed the effects of rapid thermal annealing on the composition and on the bonding and optical properties of amorphous hydrogenated silicon nitride (a-Si-x:H) thin films deposited at room temperature by the electron cyclotron resonance plasma method. Films with three different as-grown compositions have been studied, namely x = 0.97, 1.43 and 1.55, Annealing effects were related to film composition. In films with the presence of both Si-H and N-H bonds (as-grown compositions x = 0.97 and 1.43), we found that a reorganization of bonds takes place at temperatures less than or equal to 500 degrees C, where the well-known cross linking reaction Si-Si + N-H --> Si-H + Si-N occurs without detectable release of hydrogen. In the same range of temperatures, an increase of the band gap was observed and attributed to Si-Si bond substitution for Si-H, but no changes in composition were detected. At higher temperatures (T greater than or equal to 600 degrees C), the optical gap decreases and both Si-H and N-H bonds are lost along with a release of hydrogen and nitrogen. For the films with an as-gown composition x = 1.55, we observe that the release of hydrogen only occurs at temperatures above 900 degrees C, but it is not accompanied by any loss of nitrogen. An increase of the optical gap until the release of hydrogen begins and a decrease thereafter is observed.
dc.description.departmentDepto. de Estructura de la Materia, Física Térmica y Electrónica
dc.description.facultyFac. de Ciencias Físicas
dc.description.refereedTRUE
dc.description.statuspub
dc.eprint.idhttps://eprints.ucm.es/id/eprint/27041
dc.identifier.doi10.1016/S0022-3093(98)00092-1
dc.identifier.issn0022-3093
dc.identifier.officialurlhttp://dx.doi.org/10.1016/S0022-3093(98)00092-1
dc.identifier.relatedurlhttp://www.sciencedirect.com/
dc.identifier.urihttps://hdl.handle.net/20.500.14352/59293
dc.issue.numberA
dc.journal.titleJournal of Non-Crystalline Solids
dc.language.isoeng
dc.page.final527
dc.page.initial523
dc.publisherElsevier Science BV
dc.rights.accessRightsopen access
dc.subject.cdu537
dc.subject.keywordChemical-Vapor-Deposition
dc.subject.keywordSilicon-Nitride
dc.subject.keywordThin-Films
dc.subject.keywordDefects
dc.subject.keywordAlloys
dc.subject.keywordModel.
dc.subject.ucmElectricidad
dc.subject.ucmElectrónica (Física)
dc.subject.unesco2202.03 Electricidad
dc.titleInfluence of rapid thermal annealing processes on the properties of SiNx : H films deposited by the electron cyclotron resonance method
dc.typejournal article
dc.volume.number227
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dspace.entity.typePublication
relation.isAuthorOfPublication6db57595-2258-46f1-9cff-ed8287511c84
relation.isAuthorOfPublicationa5ab602d-705f-4080-b4eb-53772168a203
relation.isAuthorOfPublication.latestForDiscoverya5ab602d-705f-4080-b4eb-53772168a203

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