Rheology of conducting polymer composites for 3D printing electronic applications

Abstract

Rheological analysis is a valuable tool for comprehending the microstructure of polymeric compounds. In this work different composites from 3D printing were studied using rheology in order to choose the best formulation without the need of spending a lot of material with other techniques. In this AQ2 sense in the first stage new thermoplastic composites with biopolymeric matrix, for electrical and sensor applications, were designed selecting by means of rhe ology the best mixture for solving PLA (4:1 DCM:acetone), the amount of filler AQ3 (up to 2 wt.% of MWCNTs) and the greener additive (1 wt.% of lignine). In the second stage rheological measurements allow to design new photopolymerizable composites, for piezoresistive and piezocapacitive sensors, choosing the best combination between the amount of conducting filler (5 wt.% PANI), crosslinker (15 wt.% HDODA) and initiator (7 wt.% TPO).