Aviso: para depositar documentos, por favor, inicia sesión e identifícate con tu cuenta de correo institucional de la UCM con el botón MI CUENTA UCM. No emplees la opción AUTENTICACIÓN CON CONTRASEÑA
 

An Evaluation Framework for Dynamic Thermal Management Strategies in 3D MultiProcessor System-on-Chip Co-Design

dc.contributor.authorHuang, Darong
dc.contributor.authorCostero Valero, Luis María
dc.contributor.authorAtienza Alonso, David
dc.date.accessioned2024-09-17T10:55:33Z
dc.date.available2024-09-17T10:55:33Z
dc.date.issued2024-09-12
dc.description.departmentDepto. de Arquitectura de Computadores y Automática
dc.description.facultyFac. de Informática
dc.description.refereedTRUE
dc.description.statuspub
dc.identifier.officialurlhttps://ieeexplore.ieee.org/abstract/document/10678921
dc.identifier.relatedurlhttps://www.computer.org/csdl/journal/td/5555/01/10678921/20b3upb7gyI
dc.identifier.urihttps://hdl.handle.net/20.500.14352/108184
dc.journal.titleIEEE Transactions on Parallel and Distributed Systems
dc.language.isoeng
dc.publisherIEEE
dc.rightsAttribution-NonCommercial-ShareAlike 4.0 Internationalen
dc.rights.accessRightsrestricted access
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/4.0/
dc.subject.ucmHardware
dc.subject.unesco3304.06 Arquitectura de Ordenadores
dc.titleAn Evaluation Framework for Dynamic Thermal Management Strategies in 3D MultiProcessor System-on-Chip Co-Design
dc.typejournal article
dspace.entity.typePublication
relation.isAuthorOfPublicationb2616c88-d3da-43df-86cb-3ced1084f460
relation.isAuthorOfPublicationcbef6c8a-04b5-428f-b092-c8399eb856a4
relation.isAuthorOfPublication.latestForDiscoveryb2616c88-d3da-43df-86cb-3ced1084f460

Download

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
2024_TPDS_DTM_framework_final.pdf
Size:
3.92 MB
Format:
Adobe Portable Document Format

Collections