Aviso: Por labores de mantenimiento y mejora del repositorio, el martes día 1 de Julio, Docta Complutense no estará operativo entre las 9 y las 14 horas. Disculpen las molestias.
 

Deposition of SiNx : H thin films by the electron cyclotron resonance and its application to Al/SiNx : H/Si structures

dc.contributor.authorMartil De La Plaza, Ignacio
dc.contributor.authorGonzález Díaz, Germán
dc.contributor.authorGarcía, S.
dc.contributor.authorCastán, E.
dc.contributor.authorDueñas, S.
dc.contributor.authorFernández, M.
dc.date.accessioned2023-06-20T19:08:20Z
dc.date.available2023-06-20T19:08:20Z
dc.date.issued1998-01-01
dc.description© American Institute of Physics. The authors would like to thank E. Iborra for the facilities of the infrared characterization of the films. This work was partially supported by the Spanish Government (CICYT), under Grant TIC 93/0175.
dc.description.abstractWe have analyzed the electrical properties and bonding characteristics of SiNx:H thin films deposited at 200 degrees C by the electron cyclotron resonance plasma method. The films show the presence of hydrogen bonded to silicon (at the films with the ratio N/Si<1.33) or to nitrogen (for films where the ratio N/Si is higher than 1.33). In the films with the N/Si ratio of 1.38, the hydrogen content is 6 at. %. For compositions which are comprised of between N/Si=1.1 and 1.4, hydrogen concentration remains below 10 at. %. The films with N/Si=1.38 exhibited the better values of the electrical properties (resistivity, 6x10(13) Omega cm; and electric breakdown field, 3 MV/cm). We have used these films to make metal-insulator-semiconductor (MIS) devices on n-type silicon wafers. C-V measurements accomplished on the structures indicate that the interface trap density is kept in the range (3 - 5) x 10(11) cm(-2) eV(-1) for films with the N/Si ratio below 1.38. For films where the N/Si ratio is higher than 1.3, the trap density suddenly increases, following the same trend of the concentration of N-H bonds in the SiNx:H films. The results are explained on the basis of the model recently reported by Lucovsky [J. Vac. Sci. Technol. B 14, 2832 (1996)] for the electrical behavior of (oxide-nitride-oxide)/Si structures. The model is additionally supported by deep level transient spectroscopy measurements, that show the presence of silicon dangling bonds at the insulator/semiconductor interface (the so-called P-bN0 center), The concentration of these centers follows the same trend with the film composition of the interface trap density and, as a consequence, with the concentration of N-H bonds. This result further supports the N-H bonds located at the insulator/semiconductor interface which act as a precursor site to the defect generation of the type . Si=Si-3, i.e., the P-bN0 centers. A close relation between interface trap density, P-bN0 centers and N-H bond density is established.
dc.description.departmentDepto. de Estructura de la Materia, Física Térmica y Electrónica
dc.description.facultyFac. de Ciencias Físicas
dc.description.refereedTRUE
dc.description.sponsorshipSpanish Government (CICYT)
dc.description.statuspub
dc.eprint.idhttps://eprints.ucm.es/id/eprint/27065
dc.identifier.doi10.1063/1.366713
dc.identifier.issn0021-8979
dc.identifier.officialurlhttp://dx.doi.org/10.1063/1.366713
dc.identifier.relatedurlhttp://scitation.aip.org
dc.identifier.urihttps://hdl.handle.net/20.500.14352/59299
dc.issue.number1
dc.journal.titleJournal of Applied Physics
dc.language.isoeng
dc.page.final338
dc.page.initial332
dc.publisherAmerican Institute of Physics
dc.relation.projectIDTIC 93/0175
dc.rights.accessRightsopen access
dc.subject.cdu537
dc.subject.keywordChemical-Vapor-Deposition
dc.subject.keywordSilicon-Nitride Films
dc.subject.keywordLevel Transient Spectroscopy
dc.subject.keywordSi-SiO2 Interfaces
dc.subject.keywordRoom-Temperature
dc.subject.keywordHydrogen Content
dc.subject.keywordPlasma
dc.subject.keywordOxide
dc.subject.keywordDielectrics
dc.subject.keywordTraps.
dc.subject.ucmElectricidad
dc.subject.ucmElectrónica (Física)
dc.subject.unesco2202.03 Electricidad
dc.titleDeposition of SiNx : H thin films by the electron cyclotron resonance and its application to Al/SiNx : H/Si structures
dc.typejournal article
dc.volume.number83
dcterms.references1) D.G. Parak, M. Tao, D. Li, A.E. Botchkarev, Z. Fan, Z. Wang, S.N. Mohammed, A. Rockett, J.R. Abelson and H. Morkoc, J. Vac. Sci. Technol. B, 14, 2674 (1996). 2) K.H. Chew, J. Chen, R.C. Woods and J.L. Sohet, J. Vac. Sci. Technol. A, 13, 2483 (1995). 3) R.I. Hegde, P.J. Tobin, K.G. Reid, B. Maiti and S.A. Ajuria, Appl. Phys. Lett., 66, 2882 (1995). 4) A. Kapila, X. Si and V. Malhotra, Appl. Phys. Lett., 62, 2259 (1993). 5) P.J.M. Permiter and J.G. Swanson, J. Electron. Mater., 25, 1506 (1996). 6) Z. Lu, S.S. He, Y.Ma and G. Lucovsky, J. Non-Cryst. Solids, 187, 340 (1995). 7) Y. Ma, T. Yasuda and G. Lucovsky, J. Vac. Sci. Technol. A, 11, 952 (1993). 8) Y. Ma, T. Yasuda and G. Lucovsky, Appl. Phys. Lett., 64, 2226 (1994). 9) D.R. Lee, G. Lucovsky, M.S. Denker and C. Magee, J. Vac. Sci. Technol. A, 13, 1671 (1995). 10) Z. Ying, G. Lucovsky and J.L. Whitten, J. Vac. Sci. Technol . B, 13, 1613 (1995). 11) G. Lucovsky, Z. Ying and D.R. Lee, J. Vac. Sci. Technol. B, 14, 2832 (1996). 12) R.C. Budhani, R.F. Bunshah and P.A. Finn, Appl. Phys. Lett., 52, 284 (1988). 13) A. Stesmans, Semicond. Sci. technol., 4, 1000 (1989). 14) D. Landheer, J.A. Bardwell, I. Spraule, J. Scott-Thomas, W. Kwok and W.M. Lau, Can. J. Phys., 70, 795 (1992). 15) S. Sitbon, M.C. Hugon, B. Agius, F. Abel, J.L. Courant and M. Puech, J. Vac. Sci. Technol. A, 13, 2900 (1995). 16) S. García, J.M. Martín, I. Mártil, M. Fernández and G. González Díaz, Philos. Bag B, 73, 487 (1996). 17) Handbook of Auger Electron Spectroscopy, 2nd. ed (Physical Electronics Industries, Eden Prairie, MN, 1976). 18) W.A. Landford and M.J. Rand, J. Appl. Phys., 49, 2473 (1978). 19) L.J. Huang and K.M. Lau, Appl. Phys. Lett., 60, 1108 (1992). 20) M. Maeda and Y. arita, J. Appl. Phys., 53, 6852 (1982). 21) W.S. Lau, S.J. Fonash and J. Kanicki, J. Appl. Phys., 66, 2765 (1989). 22) E.H. Nicollian and J.R. Brews, MOS Physics and Technology (Wiley. New York, 1982). 23) D.V. Lang, J. Appl. Phys., 45, 3023 (1974). 24) M. Schulz and N.M. Johnson, Appl. Phys Lett., 31, 622 (1977). 25) S. García, J.M. Martín, M. fernández, I. Mártil, E. Iborra and G. González Díaz, J. Non-Cryst. Solids, 187, 329 (1995). 26) G.N. Parsons, J.H. Sank and J. Batey, J. Appl. Phys., 70, 1553 (1991). 27) S. Hasegawa, Y. Amano, T. Inokuma and Y. Kurata, J. Appl. Phys., 72, 5676 (1992). --- S. Hasegawa, M. Matsuda and Y. Kurata, Appl. Phys. Lett., 58, 741 (1991). 28) Y.C. Jean, H.Y. Lee and S.K. Jao, J. Appl. Phys., 75, 979 (1994). 29) S. Hasegawa, Y. Amano, T. Inokuma and Y. Kurata, J. Appl. Phys., 75, 1493 (1994). 30) S. García, D. Bravo, M. Fernández, I. Mártil and G. González Díaz, Appl. Phys. Lett., 67, 3263 (1995). 31) E.H. Poindexter, G.J. Gerardi, M.E. Bueckel, P.J. Caplan, M.M. Johson and D.K. Biegelsen, J. Appl. Phys., 56, 2844 (1984). 32) Y. Yamasaki, M. .Ooshida and T. Sugano, Jpn. J. Appl. Phys., 18, 113 (1979). 33) R. Helms and E.H. Poindexter, Rep. Prog. Phys., 57, 791 (1994). 34) T. hashizume, H. Hasegawa, R. Riemenschneider and H.L. Hartnagel, Jpn. J. Appl. Phys., Part. 1, 33, 727 (1994). 35) H. Hasegawa, M. Akazawa, H. Ishii, A Uraie, H. Iwadate and E. Ohue, J. Vac. Sci. Technol. B, 8, 867 (1990). 36) S. Dueñas, R. Peláez, E. Castán, R. Pinacho, L. Quintanilla, J. Barbolla, I Mártil and G. González Díaz, Appl. Phys. Lett., 71, 826 (1997).
dspace.entity.typePublication
relation.isAuthorOfPublication6db57595-2258-46f1-9cff-ed8287511c84
relation.isAuthorOfPublicationa5ab602d-705f-4080-b4eb-53772168a203
relation.isAuthorOfPublication.latestForDiscoverya5ab602d-705f-4080-b4eb-53772168a203

Download

Original bundle

Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
Martil,98libre.pdf
Size:
634.55 KB
Format:
Adobe Portable Document Format

Collections