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UV and visible Raman scattering of ultraheavily Ti implanted Si layers for intermediate band formation

dc.contributor.authorMartil De La Plaza, Ignacio
dc.contributor.authorGarcía Hemme, Eric
dc.contributor.authorGonzález Díaz, Germán
dc.contributor.authorOlea Ariza, Javier
dc.contributor.authorPrado Millán, Álvaro Del
dc.date.accessioned2023-06-20T03:40:53Z
dc.date.available2023-06-20T03:40:53Z
dc.date.issued2011-11-09
dc.description© 2011 IOP Publishing Ltd. The authors would like to acknowledge the CAI de Técnicas Físicas of the Universidad Complutense de Madrid for the ion implantations and metallic evaporations. This work was made possible thanks to the contract MAT2010-16116 of the Spanish Ministry of Education and Science. This work was partially supported by the Project NUMANCIA II (grant no S-2009/ENE/1477) funded by the Comunidad de Madrid and by the Project GENESIS-FV (INGENIO 2010) (grant no CSD2006-0004) funded by the Spanish Consolider National Program.
dc.description.abstractWe assess the degree of crystallinity by means of UV and visible Raman scattering measurements of Ti implanted Si layers with very high doses (10(15)-5 x 10(16) cm(-2)) subsequently annealed by nanosecond pulsed laser melting (PLM). We obtain ultraheavily impurified Si layers with Ti concentrations six orders of magnitude above the solid solubility limit in a layer several tens of nanometers thick. The PLM annealing processes are needed to recover the crystal quality and to keep the high Ti concentration required to form an intermediate band (IB). The UV Raman analysis permits us to evaluate the lattice crystallinity of the different implanted doses probing only the implanted region and points out Ti interstitial location in the host lattice in agreement with theoretical predictions for IB formation. By contrast, visible Raman spectra are only sensitive to the presence of a fully amorphized implanted layer as in the rest of the crystalline layers the probing depth far exceeds the implanted layer thickness and the signal is dominated by the undamaged Si.
dc.description.departmentDepto. de Estructura de la Materia, Física Térmica y Electrónica
dc.description.facultyFac. de Ciencias Físicas
dc.description.refereedTRUE
dc.description.sponsorshipComunidad de Madrid
dc.description.sponsorshipSpanish Ministry of Education and Science
dc.description.sponsorshipSpanish Consolider National Program
dc.description.statuspub
dc.eprint.idhttps://eprints.ucm.es/id/eprint/25821
dc.identifier.doi10.1088/0268-1242/26/11/115003
dc.identifier.issn0268-1242
dc.identifier.officialurlhttp://dx.doi.org/10.1088/0268-1242/26/11/115003
dc.identifier.relatedurlhttp://iopscience.iop.org
dc.identifier.urihttps://hdl.handle.net/20.500.14352/44233
dc.issue.number11
dc.journal.titleSemiconductor Science and Technology
dc.language.isoeng
dc.publisherIop Publishing Ltd
dc.relation.projectIDNUMANCIA II (S2009/ENE-1477)
dc.relation.projectID(MAT2010-16116)
dc.relation.projectIDGENESIS-FV (INGENIO 2010)
dc.relation.projectID(CSD2006-0004)
dc.rights.accessRightsrestricted access
dc.subject.cdu537
dc.subject.keywordAmorphous-Silicon
dc.subject.keywordDoped Silicon
dc.subject.keywordTemperature.
dc.subject.ucmElectricidad
dc.subject.ucmElectrónica (Física)
dc.subject.unesco2202.03 Electricidad
dc.titleUV and visible Raman scattering of ultraheavily Ti implanted Si layers for intermediate band formation
dc.typejournal article
dc.volume.number26
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