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Titanium doped silicon layers with very high concentration

dc.contributor.authorMartil De La Plaza, Ignacio
dc.contributor.authorGonzález Díaz, Germán
dc.contributor.authorOlea Ariza, Javier
dc.date.accessioned2023-06-20T10:43:58Z
dc.date.available2023-06-20T10:43:58Z
dc.date.issued2008-07-01
dc.description© 2008 American Institute of Physics. Authors would like to acknowledge the Nanotechnology and Surface Analysis Services of the Universidad de Vigo CACTI for SIMS measurements, the Center for Microanalysis of Materials of the Universidad Autónoma de Madrid for RBS measurements, CAI de difracción de rayos X of the Universidad Complutense de Madrid for GIXRD measurements, and CAI de Técnicas Físicas of the Universidad Complutense de Madrid for ion implantation experiments. This work was made possible thanks to the FPI (Grant No. BES-2005-7063) of the Spanish Ministry of Education and Science. This work was partially supported by the Project NUMANCIA (Grant No. S-0505/ENE/000310) funded by the Comunidad de Madrid and Project GENESIS-FV (Grant No. CSD2006-00004) funded by the Spanish Consolider National Program.
dc.description.abstractIon implantation of Ti into Si at high doses has been performed. After laser annealing the maximum average of substitutional Ti atoms is about 10(18) cm(-3). Hall effect measurements show n-type samples with mobility values of about 400 cm(2)/V s at room temperature. These results clearly indicate that Ti solid solubility limit in Si has been exceeded by far without the formation of a titanium silicide layer. This is a promising result toward obtaining of an intermediate band into Si that allows the design of a new generation of high efficiency solar cell using Ti implanted Si wafers.
dc.description.departmentDepto. de Estructura de la Materia, Física Térmica y Electrónica
dc.description.facultyFac. de Ciencias Físicas
dc.description.refereedTRUE
dc.description.sponsorshipFPI of the Spanish Ministry of Education and Science
dc.description.sponsorshipComunidad de Madrid
dc.description.sponsorshipSpanish Consolider National Program
dc.description.statuspub
dc.eprint.idhttps://eprints.ucm.es/id/eprint/25960
dc.identifier.doi10.1063/1.2949258
dc.identifier.issn0021-8979
dc.identifier.officialurlhttp://dx.doi.org/10.1063/1.2949258
dc.identifier.relatedurlhttp://scitation.aip.org
dc.identifier.urihttps://hdl.handle.net/20.500.14352/51100
dc.issue.number1
dc.journal.titleJournal of Applied Physics
dc.language.isoeng
dc.publisherAmerican Institute of Physics
dc.relation.projectIDBES-2005-7063
dc.relation.projectIDProject NUMANCIA-S-0505/ENE/000310
dc.relation.projectIDProject GENESIS-FV-CSD2006-00004
dc.rights.accessRightsopen access
dc.subject.cdu537
dc.subject.ucmElectricidad
dc.subject.ucmElectrónica (Física)
dc.subject.unesco2202.03 Electricidad
dc.titleTitanium doped silicon layers with very high concentration
dc.typejournal article
dc.volume.number104
dcterms.references1) A. Luque and A. Martí, Phys. Rev. Lett. 78, 5014 (1997). 2) J.-W. Chen, A. G. Milnes, and A. Rohatgi, Solid-State Electron. 22, 801 (1979). 3) D. Mathiot and S. Hocine, J. Appl. Phys. 66, 5862 (1989). 4) S. Hocine and D. Mathiot, Appl. Phys. Lett. 53, 1269 (1988). 5) A. Luque, A. Martí, E. Antolín, and C. Tablero, Physica B 382, 320 (2006). 6) M. H. Clark, “Laser thermal processing of novel doping schemes in silicon,” Ph.D. thesis, University of Florida, 2004. 7) E. D. Specht, C. J. Sparks, and C. J. McHargue, Appl. Phys. Lett. 60, 2216 (1992). 8) T. E. Jenkins, Semiconductor science: growth and characterization techniques (Prentice Hall, London, 1995), p. 172. 9) F. Mammoliti, M. G. Grimaldi, and F. La Via, J. Appl. Phys. 92, 3147 (2002).
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relation.isAuthorOfPublication.latestForDiscoverya5ab602d-705f-4080-b4eb-53772168a203

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