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Solderjet bumping technique used to manufacture a compact and robust green solid-state laser

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dc.book.titleProceedings of SPIE 9520, Integrated Photonics: Materials, Devices, and Applications III, 952009
dc.contributor.authorRibes Pleguezuelo, Pol
dc.contributor.authorBurkhardt, Thomas
dc.contributor.authorHornaff, M.
dc.contributor.authorKousar, S.
dc.contributor.authorBurkhardt, D.
dc.contributor.authorBecker, Erik
dc.contributor.authorGilaberte, Marta
dc.contributor.authorGuilhot, D.
dc.contributor.authorMontes, David
dc.contributor.authorGalán, Miguel
dc.contributor.authorFerrando, Sergi
dc.contributor.authorLaudisio, Marco
dc.contributor.authorBelenguer Dávila, Tomás
dc.contributor.authorIbarmia, S.
dc.contributor.authorGallego, P.
dc.contributor.authorRodríguez, J.A.
dc.contributor.authorEberhardt, Ramona
dc.contributor.authorTünnermann, Andreas
dc.date.accessioned2023-06-18T06:57:58Z
dc.date.available2023-06-18T06:57:58Z
dc.date.issued2015-06-01
dc.descriptionFrom Conference Volume 9520; Integrated Photonics: Materials, Devices, and Applications III. Jean-Marc Fédéli; Barcelona, Spain; May 04, 2015. Copyright (2015) Society of Photo Optical Instrumentation Engineers. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modification of the content of the paper are prohibited.
dc.description.abstractSolder-joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals due to a localized and minimized input of thermal energy. The Solderjet Bumping technique is used to assemble a miniaturized laser resonator in order to obtain higher robustness, wider thermal conductivity performance, higher vacuum and radiation compatibility, and better heat and long term stability compared with identical glued devices. The resulting assembled compact and robust green diode-pumped solid-state laser is part of the future Raman Laser Spectrometer designed for the Exomars European Space Agency (ESA) space mission 2018.
dc.description.departmentSección Deptal. de Óptica (Óptica)
dc.description.facultyFac. de Óptica y Optometría
dc.description.refereedTRUE
dc.description.sponsorshipMinisterio de Economía y Competitividad (MINECO)
dc.description.sponsorshipINTA (Instituto Nacional de Tecnología Aeroespacial – España)
dc.description.statuspub
dc.eprint.idhttps://eprints.ucm.es/id/eprint/39891
dc.identifier.doi10.1117/12.2178373
dc.identifier.issn0277-786X
dc.identifier.officialurlhttp://dx.doi.org/10.1117/12.2178373
dc.identifier.relatedurlhttp://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=2301353&resultClick=1
dc.identifier.urihttps://hdl.handle.net/20.500.14352/24686
dc.journal.titleProceedings of SPIE
dc.language.isoeng
dc.page.initial6p.
dc.publisherSPIE
dc.relation.ispartofseriesProceedings of SPIE
dc.rightsAtribución-NoComercial-SinDerivadas 3.0 España
dc.rights.accessRightsopen access
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/3.0/es/
dc.subject.cdu535.374
dc.subject.cdu681.7.03
dc.subject.keywordmetallic solder
dc.subject.keywordlaser soldering processes
dc.subject.keywordoptical components
dc.subject.keywordRaman Laser Spectrometer
dc.subject.ucmÓptica (Física)
dc.subject.ucmMateriales ópticos
dc.subject.ucmLáseres
dc.subject.unesco2209.19 Óptica Física
dc.subject.unesco2209.14 Propiedad ópticas de los sólidos
dc.subject.unesco2209.10 Láseres
dc.titleSolderjet bumping technique used to manufacture a compact and robust green solid-state laser
dc.typejournal article
dc.volume.number9520
dcterms.references[1] S. Ferrando, M. Galan, E. Mendez, E. Romeu, D. Montes, A. Isern, M. Jardi, J. Juliachs, G. Viera. “INNOVATIVE OPTICAL TECHNIQUES USED IN THE RAMAN INSTRUMENT FOR EXOMARS”. ICSO International Conference on Space Optics, Greece (2010). [2] F. Rull, S. Maurice, E. Diaz, C. Tato, A. Pacros and the RLS Team, “THE RAMAN LASER SPECTROMETER (RLS) ON THE EXOMARS 2018 ROVER MISSION”. 42nd Lunar and Planetary Science Conference (2011). [3] Banse, H., Beckert, E., Eberhardt, R., Stöckl, W. and Vogel, J., “Laser Beam Soldering – a New Assembly Technology for Microoptical Systems,” Microsystems Technologies 11, pp. 186-193 (2005). [4] Faidel, H., Gronloh, B., Winzen, M., Liermann, E., Esser, D., Morasch, V., Luttmann, J., Leers, M. and Hoffmann, D., “Passive alignment and soldering technique for optical components,” Proc. SPIE 8235, 82351I (2012); doi:10.1117/12.906726. [5] Leers, M., Winzen, M., Liermann, E., Faidel, H., Westphalen, T., Miesner, J., Luttmann, J. and Hoffmann, D., “Highly precise and robust packaging of optical components,” Proc. SPIE 8244, 824404 (2012); doi:10.1117/12.920016. [6] Beckert, E., Oppert, T., Azdasht, G., Zakel, E., Burkhardt, T., Hornaff, M., Kamm, A., Scheidig, I., Eberhardt, R. Tünnermann, A. and Buchmann, F., “Solder Jetting - A Versatile Packaging and Assembly Technology for Hybrid Photonics and Optoelectronical Systems,” IMAPS 42nd International Symposium on Microelectronics, Proceedings, 406-412 (2009). [7] Burkhardt, T., Hornaff, M., Kamm, A., Rütz, M., Possner, T., Beckert, E., Eberhardt, R.and Tünnermann, A., "Assembly of a photonic wavelength-division multiplexing device using laser-based soldering," Proc. SPIE 8069, 80690V (2011); doi:10.1117/12.887001. [8] Burkhardt, T., Mohaupt, M., Hornaff, M., Zaage, B., Beckert, E., Döring, H.-J., Slodowski, M., Reimer, K., Witt, M., Eberhardt, R. and Tünnermann, A., “Packaging Technology of Multi Deflection Arrays for Multi-Shaped Beam Lithography,” IMAPS 44th International Symposium on Microelectronics, Proceedings, 600-607 (2011). [9] Burkhardt, T., Hornaff, M., Ribes, P., Kamm, A, Burkhardt, D., Kousar, S., Beckert, E., Eberhardt, R. and Tünnermann, A., “Laserlöten optischer Systeme – Anwendungen des Solderjet Bumpings,“ 9. Jenaer Lasertagung 2014, in: DVS-Berichte Band 370, Innovative Fertigung durch Lasersysteme neuester Generation, Vorträge und Posterbeiträge der 9. Jenaer Lasertagung am 20. und 21. November 2014, DVS Media, Düsseldorf, 2014, ISBN 978-3-945023-04-4, ISSN 0418-9639. [10] Beckert, E., Schreiber, P., Burkhardt, T., Werner, E. and Hülsewede, R., "Design and assembly of a miniaturized high-power laser bar to 50 um fiber coupling module," Proc. SPIE 6876, 687613 (2008). [11] Burkhardt, T., Beckert, E., Hornaff, M., Thiele, J., Burkhardt, D., Galan, M., Gilaberte, M., Ferrando, S., Montes, D., Ribes, P., Eberhardt, R. and Tünnermann, A., “Solder joining of a miniaturized laser on a multi-material smart platform,” Proceedings of the 6th Smart Systems Integration, (2012). [12] Diamond SA, “Mini-AVIM-Family”, http://www.diamond-fo.com/en/products/Assemblies---Adapters/standardsingle-fiber-based/Mini-AVIM-Family
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