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Electrical characterization of MIS capacitors fabricated from ECR-PECVD silicon oxide and silicon nitride bilayer films

dc.contributor.authorMartil De La Plaza, Ignacio
dc.contributor.authorGonzález Díaz, Germán
dc.contributor.authorPrado Millán, Álvaro Del
dc.contributor.authorSan Andrés Serrano, Enrique
dc.date.accessioned2023-06-20T10:44:53Z
dc.date.available2023-06-20T10:44:53Z
dc.date.issued2003-05
dc.descriptionInternational Conference on Materials for Microelectronics and Nanoengineering (4. 2002. Espoo, Finlandia). © 2003 Kluwer Academic Publishers. The authors would like to thank C. A. I. de Impalntación Iónica from the Complutense University in Madrid for technical assitance with the ECR-CVD system. This research was partially supported by the Spanish DGESIC under Grants No. TIC 1FD79-2085 and TIC 98/0740.
dc.description.abstractIn this study, a comparative electrical characterization of Al/SiNx/Si and Al/SiNx/SiO2/Si MIS structures has been carried out. Both SiO2 and SiNx films have been deposited by using electron-cyclotron resonance plasma-enhanced chemical vapor deposition method. C-V results show that samples without SiO2 have more defects than those with SiO2. Deep-level transient spectroscopy and conductance transient measurements demonstrate that as for the samples containing the SiO2 film, these defects are mostly concentrated in the insulator/semiconductor interface, whereas in the other case defects are spatially distributed into the insulator.
dc.description.departmentDepto. de Estructura de la Materia, Física Térmica y Electrónica
dc.description.facultyFac. de Ciencias Físicas
dc.description.refereedTRUE
dc.description.sponsorshipSpanish DGESIC
dc.description.statuspub
dc.eprint.idhttps://eprints.ucm.es/id/eprint/26141
dc.identifier.doi10.1023/A:1023907508286
dc.identifier.issn0957-4522
dc.identifier.officialurlhttp://dx.doi.org/10.1023/A:1023907508286
dc.identifier.relatedurlhttp://link.springer.com
dc.identifier.urihttps://hdl.handle.net/20.500.14352/51136
dc.issue.number5-7
dc.journal.titleJournal of Materials Science: Materials in Electronics
dc.language.isoeng
dc.page.final290
dc.page.initial287
dc.publisherKluwer Academic Publ.
dc.relation.projectIDTIC 1FD79-2085
dc.relation.projectIDTIC 98/0740
dc.rights.accessRightsopen access
dc.subject.cdu537
dc.subject.keywordInsulator-Semiconductor Structures
dc.subject.keywordConductance Transient Techniques
dc.subject.keywordC-V
dc.subject.keywordAl/SiNx
dc.subject.keywordPlasma
dc.subject.keywordH/InP
dc.subject.keywordDeposition
dc.subject.keywordQuality
dc.subject.keywordDLTS.
dc.subject.ucmElectricidad
dc.subject.ucmElectrónica (Física)
dc.subject.unesco2202.03 Electricidad
dc.titleElectrical characterization of MIS capacitors fabricated from ECR-PECVD silicon oxide and silicon nitride bilayer films
dc.typejournal article
dc.volume.number14
dcterms.references1. D. G. Park, M. Tao, D. Li, A. E. Botchkarev, Z. Fan, Z. Wang, S. N. Mohammed, A. Rockett, J. R. Abelson and H. Morkoch, J. Vac. Sci. Technol. B, 14 (1996) 2674. 2. K. H. Chew, J. Chen, R. C. Woods and J. L. Sohet, J. Vac. Sci. Technol. A, 13 (1995) 2483. 3. S. Dueñas, R. Peláez, H. Castán, R. Pinacho, L. Quintanilla, J. Barbolla, I. Mártil and G. González-Díaz, Appl. Phys. Lett., 71 (1997) 826. 4. L. He, H. Hasegawa, T. Sawada and H. Ohno, J. Appl. Phys., 63 (1988) 2120. 5. L. He, H. Hasegawa, T. Sawada and H. Ohno, Jpn. J. Appl. Phys., 27 (1988) 512. 6. E. H. Nicollian and J. R. Brews, “MOS Physics and Technology” (Wiley, New York, 1982). 7. H. Castán, S. Dueñas, J. Barbolla, E. Redondo, N. Blanco, I. Mártil and G. González-Díaz, Microelectron. Reliab., 40 (2000) 845. 8. H. Castán, S. Dueñas, J. Barbolla, E. Redondo, I. Mártil and G. González-Díaz, Jpn. J. Appl. Phys., 39 (2000) 6212. 9. H. Castán, S. Dueñas, J. Barbolla, N. Blanco, I. Mártil and G. González-Díaz, ibid. 40 (2001) 4479. 10. H. Castán, S. Dueñas, J. Barbolla, E. Redondo, I. Mártil and G. González-Díaz, J. Mater. Sci: Mater. Electron., 12 (2001) 263.
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