Conductance transient comparative analysis of electron-cyclotron resonance plasma-enhanced chemical vapor deposited SiNx, SiO2/SiNx, and SiOxNy dielectric films on silicon substrates
dc.contributor.author | Martil De La Plaza, Ignacio | |
dc.contributor.author | González Díaz, Germán | |
dc.contributor.author | Prado Millán, Álvaro Del | |
dc.contributor.author | San Andrés Serrano, Enrique | |
dc.date.accessioned | 2023-06-20T10:44:37Z | |
dc.date.available | 2023-06-20T10:44:37Z | |
dc.date.issued | 2004-01 | |
dc.description | © 2004 The Japan Society of Applied Physics. The authors would like to thank C.A.I. de Implantación Iònica from Complutense University in Madrid for technical assistance with the ECR-PECVD system. This research was partially supported by the Spanish DGESIC under grant nos. TIC 1FD97-2085 and TIC 01/1253. | |
dc.description.abstract | An interface quality comparative study of metal-insulator-semiconductor (MIS) structures based on SiNx, SiO2/SiNx and SiO(x)Ny dielectric films deposited on silicon substrates by electron-cyclotron resonance plasma-enhanced chemical vapor deposition (ECR-PECVD) has been carried out. Overall interpretation of deep-level transient spectroscopy (DLTS) and conductance transient (G-t) measurements enables us to conclude that the interface quality of Al/SiOxNy/Si MIS structures is superior to those of Al/SiNx/Si devices. Moreover,. we have proved that thermal treatments applied to Al/SiOxNy/Si capacitors induce defect passivation, possibly related to the presence of hydrogen in the films, and disorder-induced gap-state (DIGS) density maxima can decrease to values even lower than those corresponding to Al/SiNx/SiO2/Si devices. | |
dc.description.department | Depto. de Estructura de la Materia, Física Térmica y Electrónica | |
dc.description.faculty | Fac. de Ciencias Físicas | |
dc.description.refereed | TRUE | |
dc.description.sponsorship | Spanish DGESIC | |
dc.description.status | pub | |
dc.eprint.id | https://eprints.ucm.es/id/eprint/26101 | |
dc.identifier.doi | 10.1143/JJAP.43.66 | |
dc.identifier.issn | 0021-4922 | |
dc.identifier.officialurl | http://dx.doi.org/10.1143/JJAP.43.66 | |
dc.identifier.relatedurl | http://iopscience.iop.org | |
dc.identifier.uri | https://hdl.handle.net/20.500.14352/51126 | |
dc.issue.number | 1 | |
dc.journal.title | Japanese Journal of Applied Physics Part-1: Regular Papers Short Notes & Review Papers | |
dc.language.iso | eng | |
dc.page.final | 70 | |
dc.page.initial | 66 | |
dc.publisher | Inst. Pure Applied Physics | |
dc.relation.projectID | TIC 1FD97-2085 | |
dc.relation.projectID | TIC 01/1253 | |
dc.rights.accessRights | open access | |
dc.subject.cdu | 537 | |
dc.subject.keyword | Insulator-Semiconductor Structures | |
dc.subject.keyword | Induced Gap States | |
dc.subject.keyword | C-V Curves | |
dc.subject.keyword | Quality | |
dc.subject.keyword | Oxide | |
dc.subject.keyword | Oxynitride | |
dc.subject.keyword | Devices. | |
dc.subject.ucm | Electricidad | |
dc.subject.ucm | Electrónica (Física) | |
dc.subject.unesco | 2202.03 Electricidad | |
dc.title | Conductance transient comparative analysis of electron-cyclotron resonance plasma-enhanced chemical vapor deposited SiNx, SiO2/SiNx, and SiOxNy dielectric films on silicon substrates | |
dc.type | journal article | |
dc.volume.number | 43 | |
dcterms.references | 1) Y. Ma and G. Lucovsky: J. Vac. Sci. Technol. B, 12,(1994) 2504. 2) Y. Ma, T. Yasuda and G. Lucovsky: J. Vac. Sci. Technol. B, 11, (1993) 1533. 3) D. Landheer, Y. Tao, J. E. Hulse, T. Quance and D. X. Xu: J. Electrochem. Soc., 143, (1996) 1681. 4) S. V. Hattangady, H. Niimi and G. Lucovsky: J. Vac. Sci. Technol. A, 14, (1996) 3017. 5) P. K. Shufflebotham, D. J. Thomson and H. C. Card: J. Appl. Phys., 64, (1988) 4398. 6) A. Popov: J. Vac. Sci. Technol. A, 7, (1989) 894. 7) T. T. Chau, S. R. Mejia and K. C. Kao: J. Vac. Sci. Technol. B, 10, (1992) 2170. 8) S. Dueñas, R. Peláez, H. Castán, R. Pinacho, L. Quintanilla, J. Barbolla, I. Mártil and G. González-Díaz: Appl. Phys. Lett., 71, (1997) 826. 9) H. Castán, S. Dueñas, J. Barbolla, E. Redondo, N. Blanco, I. Mártil and G. González-Díaz: Microelectron. Reliab., 40, (2000) 845. 10) H. Castán, S. Dueñas and J. Barbolla: Jpn. J. Appl. Phys., 41, (2002) L1215. 11) W. Bohne, W. Fush, J. Röhrich, B. Selle, I. Sieber, Á. del Prado, E. San Andrés, I. Mártil and G. González-Díaz: Surf. Interface Anal., 34, (2002) 749. 12) Á. del Prado, F. L. Martínez, I. Mártil, G. González-Díaz and M. Fernández: J. Vac. Sci. Technol. A, 17, (1999) 1263. 13) Á. del Prado, I. Mártil, M. Fernández and G. González-Díaz: Thin Solid Films, 343–344, (1999) 437. 14) L. He, H. Hasegawa, T. Sawada and H. Ohno: J. Appl. Phys., 63, (1988) 2120. 15) L. He, H. Hasegawa, T. Sawada and H. Ohno: Jpn. J. Appl. Phys., 27, (1988) 512. 16) E. H. Nicollian and J. R. Brews: MOS Physics and Technology (John Wiley & Sons, New York, 1982), Chap. 8. 17) G.D. Wilk, R.W. Wallace and J.M. Anthony: J. Appl. Phys., 89, (2001) 5243. 18) C. Parker, G. Lucovsky and J. Hauser: IEEE Electron Device Lett., 19, (1998) 106. 19) H. Yang, H. Niimi, J. W. Keister, G. Lucovsky and J. E. Rowe: IEEE Electron Device Lett., 21, (2000) 76. 20) H. Castán, S. Dueñas, J. Barbolla, Á. del Prado, I. Mártil and G. González-Díaz: Jpn. J. Appl. Phys., 42, (2003) 4978. | |
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