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Limitations of high pressure sputtering for amorphous silicon deposition

dc.contributor.authorGarcía Hernansanz, Rodrigo
dc.contributor.authorGarcía Hemme, Eric
dc.contributor.authorMontero Álvarez, Daniel
dc.contributor.authorOlea Ariza, Javier
dc.contributor.authorSan Andrés Serrano, Enrique
dc.contributor.authorPrado Millán, Álvaro Del
dc.contributor.authorFerrer, F. J.
dc.contributor.authorMartil De La Plaza, Ignacio
dc.contributor.authorGonzález Díaz, Germán
dc.date.accessioned2023-06-18T06:56:41Z
dc.date.available2023-06-18T06:56:41Z
dc.date.issued2016-03
dc.description© 2016 IOP Publishing Ltd. Authors would like to acknowledge the CAI de Técnicas Físicas and C.A.I de Espectroscopía of the Universidad Complutense de Madrid for the use of its laboratories and FTIR measurements. This work was partially supported by the Project MADRID-PV (Grant No. 2013/MAE-2780) funded by the Comunidad de Madrid, by the Spanish MINECO (Ministerio de economía y competitividad) under grant TEC 2013-41730-R and by the Universidad Complutense de Madrid (Programa de Financiación de Grupos de Investigación UCM–Banco Santander) under grant 910173-2014. D. Montero acknowledges the Spanish MINECO (Ministerio de economía y competitividad) for financial support under contract BES-2014-067585
dc.description.abstractAmorphous silicon thin films were deposited using the high pressure sputtering (HPS) technique to study the influence of deposition parameters on film composition, presence of impurities, atomic bonding characteristics and optical properties. An optical emission spectroscopy (OES) system has been used to identify the different species present in the plasma in order to obtain appropriate conditions to deposit high purity films. Composition measurements in agreement with the OES information showed impurities which critically depend on the deposition rate and on the gas pressure. We prove that films deposited at the highest RF power and 3.4 × 10^−2 mbar, exhibit properties as good as the ones of the films deposited by other more standard techniques.
dc.description.departmentDepto. de Estructura de la Materia, Física Térmica y Electrónica
dc.description.facultyFac. de Ciencias Físicas
dc.description.refereedTRUE
dc.description.sponsorshipMinisterio de Economía y Competitividad (MINECO)
dc.description.sponsorshipComunidad de Madrid
dc.description.sponsorshipPrograma de Financiación de Grupos de Investigación UCM–Banco Santander
dc.description.sponsorshipUniversidad Complutense de Madrid (UCM)
dc.description.sponsorshipBanco Santander Central Hispano (BSCH)
dc.description.statuspub
dc.eprint.idhttps://eprints.ucm.es/id/eprint/39309
dc.identifier.doi10.1088/2053-1591/3/3/036401
dc.identifier.issn2053-1591
dc.identifier.officialurlhttp://dx.doi.org/10.1088/2053-1591/3/3/036401
dc.identifier.relatedurlhttp://iopscience.iop.org/
dc.identifier.urihttps://hdl.handle.net/20.500.14352/24641
dc.issue.number3
dc.journal.titleMaterials research express
dc.language.isoeng
dc.publisherIOP Publishing
dc.relation.projectIDTEC 2013-41730-R
dc.relation.projectIDMADRID-PV (2013/MAE-2780)
dc.relation.projectID910173-2014
dc.relation.projectIDBES-2014-067585
dc.rights.accessRightsopen access
dc.subject.cdu537
dc.subject.keywordHigh pressure sputtering
dc.subject.keywordHydrogenated amorphous silicon
dc.subject.keywordHigh deposition rate.
dc.subject.ucmElectricidad
dc.subject.ucmElectrónica (Física)
dc.subject.unesco2202.03 Electricidad
dc.titleLimitations of high pressure sputtering for amorphous silicon deposition
dc.typejournal article
dc.volume.number3
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