High pressure sputtering for kigh-k dielectric deposition. Is it worth trying?

Abstract

Our research group studies the deposition of high permittivity dielectrics by a non-standard method: high-pressure sputtering. The dielectrics studied here are gadolinium scandate deposited from dielectric targets, and gadolinium oxide deposited from a metallic target, with an in situ plasma oxidation. The stoichiometric gadolinium scandate presents a slight permittivity boost after annealing, but with gadolinium-rich scandate (grown with an annealing of a nanolaminate) the dielectric shows a high effective permittivity of 21 and no noticeable SiO2 layer at the interface with Si. On the other hand, the stacks fabricated with the metallic Gd target have a SiO2 interface less than 0.7 nm thick that can be further reduced by scavenging with Ti gates. In fact, this scavenging effect is also demonstrated for the first time with indium phosphide substrates, obtaining a low capacitance equivalent thickness of only 2.1 nm.