Comparison between n-type and p-type Al/SiNx : H/In-0.53 Ga0.47As devices deposited by electron cyclotron resonance technique

Abstract

The influence of the semiconductor doping type over the electrical properties of Al/SiNx :H/In0.53Ga0.47As metal-insulator-semiconductor (MIS) devices has been studied using capacitance-voltage (C-V) and current-voltage (I-V) measurements. The C-V data show that the SiNx:H/p-In0.53Ga0.47As interface is more defective than the SiNx,:H/n-In0.53Ga0.47As one. In both n- and p-type MIS structures, the interface trap density (D-it), the electrical breakdown field (E-B) and the resistivity (rho) are highly dependent on the insulator composition. On the other hand, rapid thermal annealing treatments at temperatures up to 600 degrees C induce a gradual improvement of both interface and SINx:H bulk quality on n-type MIS devices, whereas a continuous degradation of the SiNx:H/p-In0.53Ga0.47As interface properties is observed. Zinc out-diffusion from p-In0.53Ga0.47As towards the insulator-semiconductor interface could explain the poorest electrical characteristics of the MIS structures based on a p-type semiconductor.